CyberOptics SE-300 SPI錫膏厚度測試儀
KEEPING PACE WITH DEMANDING LINE SPEEDS CyberOptics? 100% 3D solder paste inspection system, the SE 300 Ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of your line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control. NEW FEATURES ? Multi-panel 1-D and 2-D barcode read using the system sensor ? Mechanical board stop solution ? Programming time improvement—less than 15 minutes with ODB++ file import ? Offline defect review capability ? Program call-up using bar code reader ? Robust flexible PCB warp compensation algorithm - Designed to compensate for complex warp within a field of view ? New optional sensor with an extended height range—up to 24 mils (610 microns) FIELD-PROVEN TECHNOLOGY ? High-resolution 3D sensing technology to inspect the most demanding assemblies with even subtle printing errors ? High-speed/high-resolution inspection modes to optimize system performance ? 3D height, true volume and area measurements for those PCBs with CSPs, 0201s or other small pad sizes where measuring solder volume is key for identifying solder joint reliability ? Registration measurement and bridge detection to help you fine-tune printer set up and monitor process drift ? 3D shaded view for examining solder paste deposits ? XML file format output for easy integration to Shop Floor Control systems SYSTEM ? 3D sensing system with built-in fiducial camera and lighting ? Adjustable-width, clamping conveyor system, retracts for easy board removal ? CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive ? Pentium? 4 processor: data handling and image processing
3-D 焊膏檢測系統(tǒng) SE 300
Ultra。
供應(yīng)3D 錫膏檢測儀(SPI) SPI 錫膏測厚儀，在線 SPI
這種新一代在線100%錫膏檢測系統(tǒng)把 SE 300提升到全新的水平。SE 300 Ultra 快速提供了準確的、
可靠的重復(fù)性的結(jié)果，滿足了日益提高的生產(chǎn)線周期要求。SE 300 Ultra 采用 SE 300經(jīng)過實地驗證
的技術(shù)和可靠的功能，同時增加了許多新功能。
新功能包括：改善了編程時間和檢測設(shè)置；操作用戶界面中提供了 SPC 圖表；選配的光學(xué)系統(tǒng)，擴
大了高度檢測范圍，可以測量高達24 mils (610 μm)的高度；安全的機械性電路板停板檢測解決方案。
增加的其它最新功能包括：使用系統(tǒng)傳感器實現(xiàn)1-D 和2-D 多條碼讀取功能；離線缺陷檢修工作站，
允許用戶簡便地離線檢修缺點，最大限度地提高生產(chǎn)線產(chǎn)量；技術(shù)領(lǐng)先的01005焊盤檢測功能；增
強的柔性印制電路板起翹補償功能；簡便易用的使用者操作界面和缺陷檢修功能；傳送帶自動寬度
調(diào)節(jié)功能。
該系統(tǒng)提供了超快速檢測速度，傳送帶容納從101 x 35 mm (4 x 1.4")到508 x 508 mm (20 x 20")
的面板尺寸。它提供了靈活的傳送帶軌道選項，包括前面固定軌道和后面固定軌道，使用條碼讀取
選用程序，并能夠讀取非檢測區(qū)塊點，并從檢測結(jié)果中排除數(shù)據(jù)。
此外，SE 300 Ultra 能夠處理異型焊盤，提供了杰出的焊膏高度精度每一個焊盤測量數(shù)據(jù)資料由20
萬個測量點記算得出和 XML 文件格式輸出，可以簡便地集成到車間控制系統(tǒng)中。Ultra 還擁有焊膏
高度、面積和容量測量功能，支持小于10%的 Gage R&R
